Rising damp seepage is a common problem in Singapore, especially in older buildings. It occurs when water from the ground rises up through the walls and floors of a building, causing damage and creating an unsanitary environment. This is caused by a lack of a damp-proof course (DPC) or a damaged DPC.
Prevention through Damp-proof Course (DPC) Installation
There are several ways to prevent and address rising damp seepage in Singapore. One of the most effective solutions is to install a damp-proof course (DPC) in the building. A DPC is a barrier that is placed in the walls of a building to prevent water from rising up from the ground. It can be made of various materials such as plastic, bitumen, or slate.
Improving Drainage to Reduce Chances of Rising Damp
Another solution is to improve the drainage around the building. This can be done by making sure that the ground around the building slopes away from the foundation, and by ensuring that there are no blocked gutters or downpipes. This will help to prevent water from pooling around the building, reducing the chances of rising damp seepage occurring.
Maintaining and Repairing Building Structure
It is also important to regularly maintain and repair any leaks or cracks in the building’s structure. This can help to prevent water from seeping into the building, as well as preventing mold and mildew from growing.
HVAC Maintenance and Cleaning
Additionally, a proper cleaning and maintenance of the HVAC system can also help to prevent rising damp seepage. This includes regular cleaning of air conditioning coils and ducts to remove mold and mildew, and making sure that the air conditioning system is running efficiently.
In conclusion, rising damp seepage is a common problem in Singapore, but it can be prevented and addressed through proper installation of DPC, improved drainage, regular maintenance, and proper cleaning of HVAC systems. It is important to address this issue promptly to prevent damage to the building and maintain a healthy living environment for the occupants.